TPCP8004 2008-12-18 1 toshiba field effect transistor silicon n chann el mos type (u-mos ) TPCP8004 notebook pc applications portable equipment applications ? small footprint due to a small and thin package ? high speed switching ? small gate charge: qg = 26nc (typ.) ? low drain-source on-resistance: r ds(on) = 7m (typ.) ? high forward transfer admittance: |y fs | = 21s (typ.) ? low leakage current: i dss = 10 a (max) (v ds = 30v) ? enhancement mode: v th = 1.3 to 2.5v (v ds = 10v, i d = 1ma) absolute maximum ratings (ta=25c) characteristics symbol rating unit drain-source voltage v dss 30 v drain-gate voltage (r gs =20 k ) v dgr 30 v gate-source voltage v gss 20 v dc (note 1) i d 8.3 drain current pulse (note 1) i dp 33.2 a drain power dissipation (t = 5 s) (note 2a) p d 1.68 w drain power dissipation (t = 5 s) (note 2b) p d 0.84 w single-pulse avalanche energy (note 3) e as 17.9 mj avalanche current i ar 8.3 a repetitive avalanche energy (note 4) e ar 0.021 mj channel temperature t ch 150 c storage temperature range t stg ?55 to 150 c note: for notes 1 to 5, refer to the next page. using continuously under heavy lo ads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operati ng temperature/current/voltage, etc.) are within the absolute maximum ratings. please design the appropriate reliability upon reviewing the toshiba semiconductor reliability handbook (?handling precautions?/?derating concept and methods?) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). this transistor is an electrostatic-sensitive device. handle with care. unit: mm 1,2,3 source 4 gate 5,6,7,8 drain 0.8 0.05 4 5 8 0.475 s 0.025 s m 0 . 05 a 2.4 0.1 1 m 0.05 b 0.65 a b 2.9 0.1 0.33 0.05 0.17 0.02 2.8 0.1 0.28 0.1 0.11 1.12 0.13 0.12 1.12 0.13 0.12 0.28 0.1 0.11 jedec ? jeita ? toshiba 2-3v1k weight: 0.017g(typ.) 1 2 3 4 8 7 6 5 circuit configuration lot no. 8004 1 2 3 4 8 7 6 5 marking (note 5)
TPCP8004 2008-12-18 2 thermal characteristics note 1: ensure that the channel temperature does not exceed 150c. note 2: (a) device mounted on a glass-epoxy board (a) (b) device mounted on a glass-epoxy board (b) note 3: v dd = 24v, t ch = 25c (initial), l = 0.2mh, r g = 1 , i ar = 8.3 a note 4: repetitive rating: pulse width limited by max channel temperature note 5: on the lower left of the marking indicates pin 1. characteristic symbol max unit thermal resistance, channel to ambient (t = 5 s) (note 2a) r th (ch-a) 74.4 c/w thermal resistance, channel to ambient (t = 5 s) (note 2b) r th (ch-a) 148.8 c/w (b) fr-4 25.4 25.4 0.8 (unit: mm) (a) fr-4 25.4 25.4 0.8 (unit: mm) weekly code: (three digits) week of manufacture (01 for the first week of the year, continuing up to 52 or 53) year of manufacture (the last digit of the year)
TPCP8004 2008-12-18 3 electrical characteristics (ta = 25c) characteristic symbol test condition min typ. max unit gate leakage current i gss v gs = 20 v, v ds = 0 v ? ? 100 na drain cutoff current i dss v ds = 30 v, v gs = 0 v ? ? 10 a v (br) dss i d = 10 ma, v gs = 0 v 30 ? ? drain-source breakdown voltage v (br) dsx i d = 10 ma, v gs = ? 20 v 10 ? ? v gate threshold voltage v th v ds = 10 v, i d = 1ma 1.3 ? 2.5 v v gs = 4.5 v, i d = 4.2a ? 10.5 14 drain-source on-resistance r ds (on) v gs = 10 v, i d = 4.2a ? 7 8.5 m forward transfer admittance |y fs | v ds = 10 v, i d = 4.2a 10 21 ? s input capacitance c iss ? 1270 ? reverse transfer capacitance c rss ? 240 ? output capacitance c oss v ds = 10 v, v gs = 0 v, f = 1mhz ? 380 ? pf rise time t r ? 12 ? turn-on time t on ? 23 ? fall time t f ? 9 ? switching time turn-off time t off duty 1%, t w = 10 s ? 35 ? ns total gate charge (gate-source plus gate-drain) q g ? 26 ? gate-source charge 1 q gs1 ? 3.8 ? gate-drain (?miller?) charge q gd v dd 24 v, v gs = 10 v, i d = 8.3 a ? 8 ? nc source-drain ratings and characteristics (ta = 25c) characteristic symbol test condition min typ. max unit drain reverse current pulse (note 1) i drp ? ? ? 33.2 a forward voltage (diode) v dsf i dr = 8.3 a, v gs = 0 v ? ? ? 1.2 v r l =3.57 v dd 15 v 0 v v gs 10 v 4.7 i d = 4.2a v out
TPCP8004 2008-12-18 4 100 100 2 0.8 1 v gs = 10 v 4.5 100 10 0.1 1 10 1 ta = ? 55c 25 100 0.1 1 10 0.1 1 10 100 4.2 i d = 8.3 a 2.1 0246 8 10 0 0.1 0.2 0.3 0.4 ta = ? 55c 100 25 1 2 3 4 0 10 20 30 40 0 0 4 8 12 16 20 3.0 v gs = 2.7 v 10 2.9 4 3.1 0 0.4 0.8 1.2 3.2 6 3.3 3.5 5 2.8 3.1 v gs = 2.7 v 8 2.8 0 0.2 0.4 0.6 2.9 0 2 4 6 8 10 3.0 6 10 5 i d ? v ds i d ? v ds i d ? v gs v ds ? v gs |y fs | ? i d r ds (on) ? i d common source ta = 25c pulse test common source ta = 25c pulse test common source v ds = 10 v pulse test common source ta = 25c pulse test common source v ds = 10 v pulse test common source ta = 25c pulse test forward transfer admittance |y fs | (s) drain? source voltage v ds (v) drain? source voltage v ds (v) drain current i d (a) drain-source voltage v ds (v) drain current i d (a) gate? source voltage v gs (v) drain current i d (a) gate ? source voltage v gs (v) drain current i d (a) drain current i d (a) drain? source on resistance r ds (on) (m ) 1.6 8 5 6 3.3 3.5 4 3.2
TPCP8004 2008-12-18 5 30 40 80 160 120 v ds 6 12 02 0 12 20 0 10 30 50 4 10 v dd = 24v 0 (1) (2) 0 0.5 1 1.5 0 40 80 160 120 2 ? 80 ? 40 0 40 0 2 0.5 1 1.5 2.5 c iss c oss c rss 1000 10000 10 0.1 1 10 100 10 4.5 3 v gs = 0 v 1 0 ? 0.2 ? 0.4 ? 0.6 ? 0.8 ? 1.2 1 100 ? 1 10 100 v gs = 4.5 v i d = 4.2, 8.3 i d = 2.1, 4.2, 8.3 a 0 5 10 15 25 ? 80 ? 40 0 40 80 120 160 v gs = 10 v 20 r ds (on) ? ta i dr ? v ds v th ? ta p d ? ta common source pulse test common source ta = 25c pulse test common source v gs = 0 v f = 1 mhz ta = 25c common source v ds = 10 v i d = 1ma pulse test common source i d = 8.3 a ta = 25c pulse test ambient temperature ta ( c) drain-source on resistance r ds (on) (m ) drain ? source voltage v ds (v) drain reverse current i dr (a) drain? source voltage v ds (v) capacitance ? v ds capacitance c (pf) ambient temperature ta ( c) gate threshold voltage v th (v) ambient temperature ta ( c) drain power dissipation p d (w) gate? source voltage v gs (v) total gate charge q g (nc) dynamic input/output characteristics drain? source voltage v ds (v) (1) device mounted on a glass-epoxy board (a) (note 2a) (2) device mounted on a glass-epoxy board (b) (note 2b) t = 5 s 2.1 20 40 8 16
TPCP8004 2008-12-18 6 100 t = 10 ms * 1 ms * 0.1 1 10 100 0.1 1 v dss max 10 0.1 0.0001 0.001 0.01 1 10 100 1000 1 10 100 1000 (2) (1) (1) device mounted on a glass-epoxy board (a) (note 2a) (2) device mounted on a glass-epoxy board (b) (note 2b) r th ? t w single pulse pulse width t w (s) drain? source voltage v ds (v) transient thermal impedance r th (c/w) drain current i d (a) safe operating area i d max (pulse) * * single pulse ta = 25c curves must be derated linearly with increase in temperature. 0.1
TPCP8004 2008-12-18 7 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively ?toshiba?), reserve the right to make changes to the in formation in this document, and related hardware, software a nd systems (collectively ?product?) without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba?s written permission, reproduc tion is permissible only if reproducti on is without alteration/omission. ? though toshiba works continually to improve product?s quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a ma lfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before creating and producing des igns and using, customers mus t also refer to and comply with (a) the latest versions of all re levant toshiba information, including without limitation, this d ocument, the specifications, the data sheets and applic ation notes for product and the precautions and conditions set forth in the ?tosh iba semiconductor reliability handbook? and (b) t he instructions for the application that product will be used with or for. custome rs are solely responsible for all aspects of t heir own product design or applications, incl uding but not limited to (a) determining th e appropriateness of the use of this product in such design or applications; (b) evaluating and det ermining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. toshiba assumes no liability for customers? product design or applications. ? product is intended for use in general el ectronics applications (e.g., computers, personal equipment, office equipment, measur ing equipment, industrial robots and home electroni cs appliances) or for specif ic applications as expre ssly stated in this document . product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality a nd/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or se rious public impact (?unintended use?). unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic s ignaling equipment, equipment used to control combustions or explosions, safety dev ices, elevators and escalato rs, devices related to el ectric power, and equipment used in finance-related fields. do not use product for unintended use unless specifically permitted in thi s document. ? do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is pres ented only as guidance for product use. no re sponsibility is assumed by toshiba for an y infringement of patents or any other intellectual property rights of third parties that may result from the use of product. no license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? a bsent a written signed agreement, except as provid ed in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability whatsoever, including without limitation, indirect, co nsequential, special, or incidental damages or loss, including without limitation, loss of profit s, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? do not use or otherwise make available product or related so ftware or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or m anufacturing of nuclear, chemical , or biological weapons or missi le technology products (mass destruction w eapons). product and related software and technology may be controlled under the japanese foreign exchange and foreign trade law and the u.s. expor t administration regulations. ex port and re-export of product or related software or technology are strictly prohibited exc ept in compliance with all applicable export laws and regulations. ? please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of pro duct. please use product in compliance with all applicable laws and regula tions that regulate the inclusion or use of controlled subs tances, including without limitation, the eu rohs directive. toshiba assumes no liability for damages or losses occurring as a result o f noncompliance with applicable laws and regulations.
|
